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ASPIS - PCB

 

A European Community Research Project

 

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The ASPIS Project 

  • The project is focussed on nickel-gold (ENIG) solderable finishes for PCB's.
  • The aim is to develop new and more reliable materials and processes.
  • ASPIS is a three year EC supported Framework 7 project.It is a ‘Research for SME Associations’ project where much of the work is undertaken by RTD providers - ITRI, Leicester University, LIOC and TNO.

 

Key ASPIS Objectives

  • Increase the knowledge and awareness of all key failure modes
  • Improve the ability to predict, detect and prevent problems from arising.
  • Refine and develop materials, processes and methods by intelligent selection and modification.
  • Establish PCB design rules to minimise risk for a specific type of PCB.
  • Develop a practical and coherent methodology for identifying ENIG-related problems in order to enable the appropriate remedial action to be taken at the earliest opportunity and to reduce costs
  • Contribute to an improved international standard for specifying high reliability PCB finishes.